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February 13 2006 at 02:47 PM
Barcelona, 13th February 2006 - Fractus, the pioneer developer of fractal antenna technology, will unveil the world’s first commercially available full wireless system in package (FWSiP) technology at 3GSM 2006 in Barcelona.
FWSiP is a single package complete wireless solution which means that any device can be easily and cost-effectively wireless-enabled without the need for the manufacturer to have any RF expertise.
FWSiP is the next stage of the evolution of SiP (System in Package) technology which delivers most of the functions of an electronic system within a single package on the PCB (Printed Circuit Board). Traditional wireless SiP technology has however required a separate antenna component which demands additional space, electronic interconnections and other measures to avoid RF interference.
“The history of telecommunications has been in connecting the phone and the computer; the future is in connecting everything else,” said Tim Hillison, Fractus’ Short-Range Wireless Division Director. “For the first time ever, within a small section of a PCB, a manufacturer can completely wireless-enable any device from watches to washing machines. We fully believe that this technology will revolutionise the wireless marketplace.”
FWSiP will also help reduce the bill of materials, component size, motherboard complexity, design cost and time to market for devices where wireless capability already exists such as mobile handsets. It also facilitates the implementation of discrete wireless functions within mobile devices such as cameras and PDAs.
Fractus will license FWSiP to electronics component and semiconductor manufacturers who will incorporate FWSiP wireless components into new or existing packages and chipsets.
The product is very flexible so that OEM/ODMs can just advise what wireless standards they want the device to support and the component manufacturer can simply add the relevant FWSiP onto an existing chipset.
Fractus will be demonstrating the effectiveness of the technology with a transparent Bluetooth USB dongle adaptor on their booth on Stand J40 (Hall 2, Level 1).